发明名称 LEAD INSPECTING METHOD FOR IC PACKAGE
摘要 PURPOSE:To inspect leads of IC packages speedily by picking up images of one-side parts of two IC packages at the same time by using 45 deg. reflecting mirrors. CONSTITUTION:Two right-angled prisms 9 are set between measurement tables 10 and 11, and an A side 5 of an IC package 1 on the measurement table A10 and a B side 6 of an IC package on the measurement table 11 are picked up by an ITV camera 2 at the same time to inspect the two sides. Further, right- angled prisms 9 are set between measurement tables 12 and 13 and a C side 7 and a D side 8 of the IC packages are picked up similarly by the ITV camera 2 at the same time to inspect the two sides. The IC packages 1 are conveyed in the order of the measurement table A10, measurement table B11, a repeating table 14, and the measurement tables C12 and D13 without being changed in direction to inspect four sides.
申请公布号 JPH01295141(A) 申请公布日期 1989.11.28
申请号 JP19880124166 申请日期 1988.05.20
申请人 SEIKO EPSON CORP 发明人 KURAUCHI NOBUYUKI
分类号 G01N21/88;G01N21/956;H01L21/66;H05K13/08 主分类号 G01N21/88
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