| 摘要 |
PURPOSE:To eliminate the generation of a flaw or chipping in a peripheral edge part, by a method wherein an ink passage forming member is cut to provide a groove to the member and subsequently cut along said groove by a resin bonded cutting blade containing SiC whiskers to form an emitting orifice. CONSTITUTION:A required number of heating elements 2 are arranged on a substrate 1 such as a silicon wafer and an SiO2 protective film 3 is formed thereon. Subsequently, a photosensitive resin film 4 is superposed on said film 3 to be exposed and an unexposed part is dissolved and removed by a developing solution to form an ink passage 8 by the patterned resin film 4p. Next, a flat plate 6 such as a glass plate is superposed through a photosensitive resin layer 7 and irradiated with ultraviolet rays to be fixed. This bonded body is cut and removed (grooved) along a line C-C' at first by a blade composed of diamond grinding particles so as to slightly leave the upper part of an emitting orifice and subsequently cut by a resin bonded extremely thin cutting blade containing SiC whiskers to form an ink emitting orifice. By this method, the flaw or chipping generated in the peripheral edge of the emitting orifice by cutting is eliminated and stable emitting capacity can be obtained. |
