发明名称 HOOKING EQUIPMENT FOR ELECTROPLATING
摘要 PURPOSE:To uniformly form a plated film and to improve quality by constituting the title hooking equipment so that a hooking jig incorporated in a carrier device transferring between the plating tanks parallel provided is automatically rotated in the plating tanks and in the upper part of the outsides of the tanks. CONSTITUTION:A hooking jig fitted with a material to be plated is hung with a conductive bar 1 and transferred to the upper part of the plating tanks by a carrier device of the outer part and immersed in plating liquid. A driving beam 4 is engaged with the drivers positioned to the sides of the plating tanks and the beam 4 repeats reciprocating motion to the nearly horizontal direction in a range within the constant distance by actuation of the drivers. Successively a rack provided to the beam 4 is moved to the same direction and joined to a pinion fitted to the bar 1 and a lever is rotated. Furthermore the jig 6 repeats the fore and back rotation at the required angle in the plating tanks via a continuous beam and both the upper and lower positions and the direction of the material to be plated are displaced. Together therewith treatment liquid is efficiently agitated by the agitation fins 18 and plating is performed while bringing fresh treatment liquid into contact with the material to be plated.
申请公布号 JPH01294898(A) 申请公布日期 1989.11.28
申请号 JP19880125590 申请日期 1988.05.23
申请人 USUI INTERNATL IND CO LTD 发明人 AKIYAMA MASAAKI
分类号 C25D17/08;C25D21/00;C25D21/10 主分类号 C25D17/08
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