| 摘要 |
PURPOSE:To obtain a method for effectively forming a bump on a predetermined bonding pad with a less number of steps by filling a resin material mixed with heat resistant substance in the opening of a resist in which the pad is exposed, removing the resist, and then sintering the substance by baking. CONSTITUTION:When a bump 1 disposed on a bonding pad 3 provided on the surface of a semiconductor substrate 2 for attaching the other end of a wiring member connected at its one end to an extraction electrode is formed, only the arranging position of the pad 3 is exposed to form a resist 5, a resin material mixed with heat resistant conductive substance is filled in the opening of the resist 5 in which the pad 3 is exposed, and a resin material layer 10 is formed on the pad 3. Then, after the layer 10 is removed and the resist 5 is removed, the layer 10 is baked, the substance is sintered to form the bump 1. For example, as the resin material, epoxy resin paste containing silver is employed and then baked at 200-300 deg.C, and the silver is sintered. |
