| 摘要 |
<p>PURPOSE:To prevent an external electrode from being stripped off from an insulating substrate by a method wherein a deformationabsorbing material capable of deforming a thermal expansion is installed between a sealing resin layer inside an outer packaging container and a wall face of the outer packaging container in order to absorb the thermal expansion of the sealing resin layer due to heat generated by a semiconductor device. CONSTITUTION:The following are installed: an outer packaging container 8 fixing and holding a semiconductor chip 6 in its inside; external electrodes 4 which have been wired to the chip 6 and whose one end protrudes from the container 8; a sealing resin layer 9 which fills the inside of the container 8 and seals the chip 6. During this process, a deformation-absorbing material 11 which absorbs a thermal deformation is installed between the resin layer 9 and a wall face constituting the container 8. Since the absorbing material 11 has an easily deformed property, a deformation due to a thermal expansion of the resin layer 9 is absorbed by itself. By this setup, it is possible to prevent the electrodes 4 from being stripped off from an insulating substrate 2.</p> |
