| 摘要 |
PURPOSE:To suppress the side-etching by a method wherein a copper layer is formed as a conductor pattern are etching-resistant layers made of organic material having affinity with copper are formed on the side surfaces of the copper layer. CONSTITUTION:A film 14 made of metal other than copper is formed on a copper foil 12 formed on a substrate 10. A resist layer 16 which has the reverse pattern of a conductor pattern and is made of photosensitive resin is formed on the metal film 14 and the parts of the metal film 14 which are not covered with the resist layer 16 are removed. After that, copper layers 18 of which the conductor pattern is composed are formed on the removed parts and etchingresistant layers 19 made of metal other than copper are formed on the top surfaces of the copper layers 18 and the resist layer 16 is removed. After the metal layer 14 under the resist layer 16 is exposed, etching-resistant layers 22 made of organic material having affinity with copper are formed on the side surfaces of the copper layers 18 and the exposed metal layer 14 which is not covered with both the etching-resistant layers 19 and 22 is removed to form the conductor pattern. With this constitution, when etching is carried out, the side surfaces of the copper layers are not etched and only the parts corresponding to the thickness of the copper foil 12 are side-etched. |
