| 摘要 |
PURPOSE:To obtain a wiring board which is superior in heat-resisting properties and a thermal conductive resistance and further, is achieving a high productivity, by causing the above board to be composed of a metal core, a resin insulating layer, and a ceramic insulating layer. CONSTITUTION:The prescribed amount of ceramics such as alumina and the like is deposited on a metallic board (core) 4 by thermal spraying and then, the board 4 equipped with a ceramic insulating layer 2 is formed. A metallic foil 6 is bonded to the above board by using a resin insulating layer 1. A circuit is formed by removing unnecessary parts of the metallic foil 6 through etching. A wiring board is thus formed without using a metallic paste on the wiring board. Heat-resisting properties and a thermal conductive resistance are thus improved and fine circuits are easily formed as well. |
