High density controlled impedance connector

摘要

A high speed, high density, controlled impedance connector for use between printed circuit boards is disclosed. The connector provides for both power and signal transmission. Closely spaced signal terminals are surrounded by dielectric sleeves positioned in an array, and the plural dielectric sleeves are in turn surrounded by an outer unitary cast conductive housing. The essentially coaxial configuration of the contacts permits minimal variations in the impedance along the length of the signal paths in the connector. The connector is fabricated by first positioning the dielectric sleeves in spaced relationship on prescribed centerlines and subsequently casting or molding the conductive outer housing around the sleeve array.