| 摘要 |
<p>PURPOSE:To enhance the working accuracy and to feed chip-type capacitors efficiently by linking the capacitors at a constant spacing on a substrate which has been molded together with other package frames. CONSTITUTION:Individual outer package frames 2 are linked at a constant spacing on a substrate 8, and form an aggregate of the outer package frames 2; capacitors 1 are housed one after another in them; a linked body 9 is obtained. It is possible to form the aggregate integrally in a molding process of the outer package frames 2; it is possible to unify a direction of all the outer package frames 2 to be fed as the aggregate. Accordingly, in a process to house the capacitors 1 in housing spaces 4 of the outer package frames 2, it is not required to arrange and adjust the direction of the outer package frames 2. Since the outer package frames 2 are linked by the substrate 8 integrally molded with them and form the linked body 9, a plurality of chip-type capacitors can be fed to a mounting process at a fixed spacing. By this setup, the capacitors can be fed continuously and mounted efficiently.</p> |
