| 摘要 |
An R-F electrode apparatus is provided featuring self-adjusting, spring biased electrodes, removably attached to a removable substrate holder, within a chamber used for plasma reactive treatment processes, particularly those involving semiconductor wafers. The apparatus further features base electrodes shaped and supported to insure uniform transmission of electrical energy during operation. The apparatus also provides an automatic means for wiping, self-cleaning action between the contact surfaces of opposing electrodes during introduction and removal of the substrate holder from the reaction chamber. The base electrodes are removably attached to standard electrical feedthroughs located in the reaction chamber wall, which lead to an external R-F power supply.
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