| 摘要 |
PURPOSE:To miniaturize a device by a method wherein a bared section of a lead is allowed to abut against an end face recess in a hard printed wiring board(PWB) for connection and fixation for connection of leads to the PWB in a manner that the leads is vertical to the plane of the PWB. CONSTITUTION:A terminal pattern 1A is formed on the surface of a printed wiring board(PWB) 1, and a side thereof extends as far as an end face recess 1B formed in an end face of the PWB 1. For the connection of a lead 2 to the PWB 1, a bared section 2A of the lead 2 is allowed to catch the end face recess 1B in the PWB 1, and then solder 3 is applied for the connection of the bared section 2A of the lead 2 to the terminal pattern 1A of the PWB 1. In this way, the gap between an end face letting a lead through and a device external cover may be as small as half the lead diameter, even when a lead is to be drawn from beneath a PWB, which miniaturizes the device. |
