| 摘要 |
An improved seal for electronic components is disclosed, having a hydrophobic, microporous membrane sealed about a housing aperture to provide substantial internal to external pressure equalization during temperature and pressure variations encountered during the solder and cleaning process, while substantially sealing the housing aperture from damaging amounts of external contaminating fluids. The microporous membrane may be secured to a non-porous tape about a tape aperture, and the tape may be secured to the electronic component housing about the housing aperture; or the microporous membrane may be secured directly to the housing about the housing aperture. The hydrophobic, microporous membrane may be permanently sealed to the electronic component housing about the housing aperture; or the microporous membrane may be removed after the solder and cleaning process is completed. A tab portion may be secured to the microporous membrane for ease of removal.
|
