| 摘要 |
<p>PURPOSE:To make it possible to easily fix a water having any outside diameter to a prescribed position by a method wherein a mechanism, which fixes a wafer by the same pressing forces from the circumference of the wafer, is arranged on the prescribed position of the device. CONSTITUTION:A bearing hole 10a is provided on a prescribed position of a point P on the circumference having a prescribed point C of a circular stage 10 having its center at the point C. Also, a curved rotatable plate lever 11, to be combined to the upper surface of the stage 10, is provided with a rotary shaft 11a, which is fitted to the bearing hole 10a and smoothly rotated, on one end and a guide pin 11b protruding to the surface reverse to the rotary shaft 11a on other end, and a sliding pin 11c, protruding in the same direction as that of the guide pin 11b, is fixed to almost in the middle part in longitudinal direction of the rotary lever 11. Accordingly, in the state wherein the rotary shaft 11a of the rotary lever 11 is inserted into the bonding hole 10a provided at the point P of the stage 10, the rotary lever 11 can be freely rotated with the point P as the center. As a result, what kind of wafer can be positioned at the prescribed place continuously in an easy and accurate manner irrespective of the outside diameter of the wafer.</p> |
