发明名称 CROSSOVER FORMING METHOD
摘要 PURPOSE:To suppress oozing of conductor paste, and to prevent a short-circuit or the like by forming a pattern of an insulator between the adjacent patterns of an upper conductor pattern formed later before the upper conductor pattern is formed on an insulating layer on a first thick film wiring pattern. CONSTITUTION:When a plurality of second parallel thick film wiring patterns 3 cross a first thick film wiring pattern 2, a first wiring pattern 2 is formed, the second wiring patterns 3 are formed except an intersection, insulator paste 4' containing as a main ingredient glass is printed on the intersection, and dried. Then, alter the paste is printed between upper conductor patterns 5 formed in a later step on the paste 4', dried, and simultaneously baked together with the paste 4' to form an insulating layer 4 and an insulator pattern 6. Conductor paste is so printed and baked as to connect the second patterns 3 on an insulating layer 4 to form the patterns 5. Thus, it can suppress oozing of the paste for the upper conductor pattern and prevent the patterns from short- circuiting therebetween.
申请公布号 JPH01287991(A) 申请公布日期 1989.11.20
申请号 JP19880115988 申请日期 1988.05.14
申请人 FUJITSU LTD 发明人 KUTOKU TERUYOSHI
分类号 H05K3/46;H05K1/11;H05K3/10 主分类号 H05K3/46
代理机构 代理人
主权项
地址