| 摘要 |
PURPOSE:To improve heat dissipation by disposing a thermal conductive metallic platelike body in which a clearance is formed at a position to be provided with a conductor. CONSTITUTION:A metallic platelike body 6 is disposed in a state buried in an outermost layer surface 1, a clearance is formed at the body 6, and it is not conducted with a through hole 5 of a conductor. The body 6 is thermally conductive with good heat dissipation, formed, for example, of an aluminum plate, a silicon steel plate, etc., and its thickness is suitably 10mum-5.0mm. Thus, even if a placed electronic component generates heat, the heat can be dispersed in the whole wiring board. Accordingly, the concentration of the heat can be avoided, and the whole board becomes a heat dissipating area, thereby improving heat dissipating effect. |
