| 摘要 |
PURPOSE:To seek to improve heat radiation property by forming an inside conductor layer inside an internal connection part and exposing this inside conductor layer so as to make it serve as an electronic parts mounting part. CONSTITUTION:This is a substrate in which the connection part of electronic parts mounted on a base material and each lead projecting from the base material are connected electrically, wherein an inside conductor layer 14 is formed inside the internal connection part 18 and this inside conductor layer 14 is exposed to make it act as an electronic parts mounting part 21. Hereby, heat generated by applying electricity to the electronic parts mounted on the substrate for mounting electronic parts transmits to the inside conductor layer connected with the electronic parts and is radiated to the inside conductor layer, therefore the heat radiation property can be elevated greatly.
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