| 摘要 |
PURPOSE:To improve the throughput in a manufacturing line, and enable the cost reduction by forming a dam to be arranged on the upper surface of a base, by using adhesive agent. CONSTITUTION:On a dam forming part on the periphery of a semiconductor chip 12 in the central part of the upper surface of a base 11, an adhesive agent like silicon rubber having high viscosity is spread so as to be higher than the upper surface of a semiconductor chip 12. In a region surrounded by said silicon rubber or the like, coating material 17 like silicon gel or the like is subjected to potting so as to completely cover the semiconductor chip 12 and an aluminum wire 15. The adhesive agent and the coating material 17 are hardened at the same time by baking. After that adhesive agent like silicon rubber is spread on the fixing part of a cap 18, and fixed by performing baking while pressure is applied to the cap 18. The cap is provided with a recessed part so as to hide the tops 19 of lead pins 14. |
