| 摘要 |
<p>PURPOSE:To exclude expensive useless connection metal, prevent the decrease of yield, and enable highly reliable mounting by using a substrate of connection use linking a carrier film to a semiconductor chip. CONSTITUTION:A substrate 5 of connection use composed of electric insulator like glass is provided with a plurality of wiring patterns having electric conductivity, in the vicinity of the four corners. on the inside and the outside, a bump 2a and a bump 2b are arranged, respectively. In the state where a semiconductor chip 1 is mounted On a carrier film 3 via the substrate 5 in connection use by employing a member constituted in the above mentioned manner, an electrode terminal of the semiconductor chip 1 and a lead 4 of the carrier film 3 are connected with the bump 2a and the bump 2b on the inner side and the outer side, respectively, by thermal compression bonding. Since the bump is not formed on the semiconductor chip in this manner, useless formation of bumps on defective articles can be avoided. Further, the decrease of yield in the bump forming process of a semiconductor chip can be avoided.</p> |
