发明名称 |
LAMINATED BOARD FOR ELECTRIC CIRCUIT |
摘要 |
PURPOSE:To obtain a laminated board for electric circuit readily processable, having excellent electric properties, by impregnating curable resin comprising main chain of vinyl polymer and side chain having radically curable double bond to a base material, laminating and curing. CONSTITUTION:A base material impregnated with a curable resin liquid containing double-bonded side chain type resin (e.g., polymer expressed by the formula) comprising a main chain made of backbone polymer containing vinyl monomer unit having functional group and side chain having branch containing radically curable carbon.carbon double bond constructed through the functional group of main chain. The resultant base material is laminated and cured to afford the aimed laminated board. |
申请公布号 |
JPH01287145(A) |
申请公布日期 |
1989.11.17 |
申请号 |
JP19880116527 |
申请日期 |
1988.05.13 |
申请人 |
SHOWA DENKO KK;SHOWA HIGHPOLYMER CO LTD |
发明人 |
YOSHIDA MASAHARU;SUZUKI NOBORU;HASHIMOTO TADAYOSHI |
分类号 |
B32B15/08;C08J5/24;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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