发明名称 LAMINATED BOARD FOR ELECTRIC CIRCUIT
摘要 PURPOSE:To obtain a laminated board for electric circuit readily processable, having excellent electric properties, by impregnating curable resin comprising main chain of vinyl polymer and side chain having radically curable double bond to a base material, laminating and curing. CONSTITUTION:A base material impregnated with a curable resin liquid containing double-bonded side chain type resin (e.g., polymer expressed by the formula) comprising a main chain made of backbone polymer containing vinyl monomer unit having functional group and side chain having branch containing radically curable carbon.carbon double bond constructed through the functional group of main chain. The resultant base material is laminated and cured to afford the aimed laminated board.
申请公布号 JPH01287145(A) 申请公布日期 1989.11.17
申请号 JP19880116527 申请日期 1988.05.13
申请人 SHOWA DENKO KK;SHOWA HIGHPOLYMER CO LTD 发明人 YOSHIDA MASAHARU;SUZUKI NOBORU;HASHIMOTO TADAYOSHI
分类号 B32B15/08;C08J5/24;H05K1/03 主分类号 B32B15/08
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