| 摘要 |
<p>PURPOSE:To obtain, directly on an aluminum electrode pad, a reliable bump electrode with uniform height by arranging an alloy layer composed of aluminum and metal which is easy to form solid solution with aluminum, on an aluminum electrode pad formed on a silicon wafer, and arranging a spheric solder bump electrode on the alloy layer. CONSTITUTION:The surface oxide film of an aluminum electrode pad 8 formed on a silicon wafer 1 is subjected to sputtering, and solder whose main component is lead and tin is vapor-deposited thereon. Before that or at the same time, metal which is easy to form solid solution with aluminum is vapor-deposited, an alloy layer 9 of aluminum having tight adhesion to aluminum is formed. After a solder film 12 having tight adhesion to aluminum is formed thereon, by vapor-depositing solder whose main component is lead and tin, solder except aluminum electrode pad 8 is eliminated, and a specified amount of solder 13 is supplied on the solder film 12, which is heated at a temperature higher than or equal to the melting point of solder: thereby forming a spheric solder bump electrode 10.</p> |
