| 摘要 |
PURPOSE: To reduce a failure rate drastically by retaining a pin grid array(PGA) to be plated, keeping contact positively over the entire pin, and performing plating uniformly within a plating bath. CONSTITUTION: A pre-bent PGA is inserted into a placing device. The device is formed by a metal substrate that is mainly made of titanium or V.4A steel, and a round or wedge-shaped metal rod member made of the same material as the metal substrate is arranged in parallel with both opposing edges of the metal substrate. For example, a base 6 of the wedge is larger than a gap 2 of two adjacent rows of pins by approximately 0-5%, a height 7 of the rod member is approximately half a length 9 of the pin of the PGA, and a gap 11 of two rod members is double the gap 2 of the two rows of pins. A through hole is created in a substrate 12, an electrical plating frame is brought into contact with a cathode, the frame is dipped into an electrical plating bath, metal is deposited, and then an electrical plating frame is taken out of the electrical plating bath. |
