| 摘要 |
PURPOSE:To prevent ceramics from damaging due to an external force applied to input/output pins by laminating a green sheet in which a part corresponding to an input/output pin bonding position is punched on an uppermost layer to form the ceramics, and increasing the thickness of the resin of an input/output pin bonding part. CONSTITUTION:A green sheet, in which a part 20 corresponding to a bonding position of I/O pins 4 is punched in a square shape or the like, is superposed as a dummy layer 1a on an uppermost layer and sintered. The I/O pin bonding part of the front face of the sintered ceramic board is formed in a recess shape, and than finished in a flat face by thereafter coating with resin by spin coating and firing. Accordingly, the resin at the I/O pin adhering part is formed thicker in the thickness corresponding to the thickness of the punched sheet. Thus, the stress of the ceramics against the external force to be applied to the bonding pin 4 can be largely alleviated. |
