| 摘要 |
<p>A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented. The flexible circuit is made by providing through-holes (58) to a standard single sided laminate (50). Conductive material (60) is vacuum deposited into the through-holes and at the same time a conductive seed-layer is deposited on the polymer side of the standard laminate. Plating resist (62) is applied to both sides of the material and the seed-layer side of the material is patterned such that circuit traces, pads, and through-holes can be electroplated with additional copper (64). The plating resist (62) is stripped and the very thin layer of copper in the non-conductive areas is flash etched to produce semi-additive circuit features on the seed-layer side. Etch resist is then applied to both sides of the material and circuit patterns fabricated on the foil-side of the material. A cover film (66) and (68) coated with adhesive (70) and (72) is then provided over the exposed circuit patterns.</p> |
