发明名称 Method for determining mechanical stress conditions in electrical or electronic components to be coated, or already coated, with moulding compound
摘要 Method for determining mechanical stress conditions in electrical or electronic components to be coated, or coated already, with moulding compound by means of strain measurements using strain gauges both during the production process and under operating loads. <IMAGE>
申请公布号 DE3815566(A1) 申请公布日期 1989.11.16
申请号 DE19883815566 申请日期 1988.05.06
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 WAGNER, GEORG, 8011 EGLHARTING, DE
分类号 G01L1/22;G01L5/00 主分类号 G01L1/22
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