| 摘要 |
PURPOSE:To improve the function of a solid state image pickup device by sealing mounting parts on which photoelectric conversion element chips are mounted with a translucent substance, while by sealing mounting parts on which element chips other than the photoelectric conversion element chips are mounted with a light shielding or translucent substance. CONSTITUTION:In a package structure where chips can be mounted on both surfaces, a solid state image pickup element chip 6'-1 is mounted on a surface of a package 12 onto which light is injected and a drive circuit or a signal processing circuit, etc., on a surface thereof onto which light is not injected. The side onto which the light is injected is sealed by a translucent plate 10', while the side onto which the light is not injected is sealed, as necessary, by sealing means 14 such as a translucent or nontranslucent plate. Accordingly, many function circuit chips 6'-2 in addition to the solid state image pickup element chip 6'-1 can be mounted with in the same mounting device, thereby reducing image pickup the size of and increasing the functions of the solid state image pickup element device. |
