Method for applying a moistureproof insulative coating to printed circuit boards using triangular or dovetail shaped liquid films emitted from a flat-pattern nozzle,申请号US19880206199-传众专利搜索

发明名称	Method for applying a moistureproof insulative coating to printed circuit boards using triangular or dovetail shaped liquid films emitted from a flat-pattern nozzle
摘要
申请公布号	US4880663(A)	申请公布日期	1989.11.14
申请号	US19880206199	申请日期	1988.06.13
申请人	NORDSON CORPORATION	发明人	SHIMADA, TAKAJI
分类号	H05K3/28;B05B1/04;B05B13/04;B05D1/02;B05D1/32;H05K3/00	主分类号	H05K3/28
代理机构		代理人
主权项
地址