| 摘要 |
PURPOSE:To make adhesives flow toward stepped sections, and to improve mounting properties by forming the stepped sections to a surface, on which a semiconductor element is loaded, in a ceramic case for a semiconductor and a surface in the periphery of the surface. CONSTITUTION:A region being isolated from a loading surface by a stepped section 5 and lower than the loading surface is shaped around the surface on which a semiconductor element 2 is loaded. Adhesives 4 are applied onto the surface, on which the element 2 is loaded, in a ceramic case 11 for a semiconductor, and the element 2 is picked up by a collet 3 and pushed against the surface coated with adhesives 4. Even when the collet 3 is moved to the left and the right, the extruding adhesives 4 gradually flow toward an underside, to which the stepped section 5 is shaped, from the surface on which the element 2 is loaded. Accordingly, mounting properties are improved.
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