发明名称 |
Semiconductor integrated circuits with a protection device |
摘要 |
The semiconductor integrated circuit comprises a semiconductor substrate having a circuit region, a pad formed at the surface of the semiconductor substrate and forming a PN junction with the semiconductor substrate, and first and second electrodes. Each electrode contacts the semiconductor region such that the contacting regions of the electrodes face each other with a ring shaped region between.
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申请公布号 |
US4881113(A) |
申请公布日期 |
1989.11.14 |
申请号 |
US19860924444 |
申请日期 |
1986.10.29 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MOMODOMI, MASAKI;OGURA, MITSUGI;KUMANOMIDO, TAKAKI |
分类号 |
H01L27/04;H01L21/3205;H01L21/822;H01L23/52;H01L27/02 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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