| 摘要 |
A semiconductor device is prepared by forming a resin layer for shielding alpha-rays by coating a part of the surface of the semiconductor element and simultaneously sealing with a plastic or ceramic package. The resin for shielding alpha-rays is polyimide resin which is a polymer, obtained by the polycondensn. of 4,4'- diamino-diphenylether, with 3,3',4,4'-biphenyl-tetracarboxylic acid dianhydride, 4,4'-diamino-diphenylether with 3,3',4, 4'-biphenyl- tetracarboxylic acid dianhydride and pyromellitic acid dinhydride, or 4,4'-diamino-diphenylether with p-phenyl-enediamine and 3,3'-4,4'- biphenyl-tetracarboxylic acid dianhydride. |
