发明名称 VAPOR PHASE SOLDERING DEVICE
摘要 PURPOSE:To secure the safety of a vapor phase soldering device by closing a vapor tank to the inner part of a heat exhaust cover and providing a vent on the side face and upper face of the heat exhaust cover. CONSTITUTION:A work carry-in port 32 and carry-out port 33 are provided on a heat exhaust cove 31 and a vapor tank 11 is stored at the bottom part. An inert vapor phase 15 is formed at the inner part of the vapor tank 11 and a work 16 is subjected to reflow soldering by the vaporized latent heat thereof. Vents 34, 35, 36, 37 are provided on the side face and upper face of the heat exhaust cover 31 and the air inside the heat exhaust cover 31 is sucked to the external part forcibly therefrom. Consequently the safety of a vapor phase soldering device can be secured.
申请公布号 JPH01278963(A) 申请公布日期 1989.11.09
申请号 JP19880109985 申请日期 1988.05.06
申请人 TAMURA SEISAKUSHO CO LTD 发明人 SOTONO KAZUO;YAMASHITA FUMIHIRO
分类号 B23K1/015 主分类号 B23K1/015
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