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发明名称
PRESOLDERING METHOD FOR LEAD OF ELECTRONIC PARTS
摘要
申请公布号
JPH01278967(A)
申请公布日期
1989.11.09
申请号
JP19880109167
申请日期
1988.05.06
申请人
SENJU METAL IND CO LTD
发明人
SUDA HIDEHARU;SAKAMOTO NOBUO
分类号
B23K3/06;H05K3/34
主分类号
B23K3/06
代理机构
代理人
主权项
地址
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