KUPFERLEGIERUNGSMATERIAL FUER LEITUNGSRAHMEN VON HALBLEITERVORRICHTUNGEN

摘要

A copper alloy material for lead frames for semiconductor devices. The lead frame material consists essentially of: Ni: 0.5-2 percent by weight; Sn: 1.2-2.5 percent by weight; Si: 0.05-0.5 percent by weight; Zn: 0.1-1 percent by weight; Ca: 0.001-0.01 percent by weight; Mg: 0.001-0.05 percent by weight; Pb: 0.001-0.01 percent by weight; and Cu and inevitable impurities: the balance. The lead frame material obtained possesses not only high strength, but also excellent thermal-exfoliation resistance of the solder, and also enhances the wear resistance of the stamping dies, while possessing excellent other properties, such as repeated-bending strength, thermal conductivity and electrical conductivity, platability, and solderability, which are required of lead frames.