| 摘要 |
PURPOSE:To prevent a peeling from generating between a sealing resin and a substrate supporting part by a method wherein groove parts of a pattern of a meanderlingly crawled form are formed in the rear of the substrate supporting part. CONSTITUTION:A lead frame, on which a semiconductor chip of a large area is mounted, is set in a metal mold and when a sealing resin 7 is poured in this metal mold, the resin 7 flows in groove parts 3 formed in the rear of a substrate supporting part 2. At this time, as the configurations of the groove parts 3 are a pattern of a meanderlingly crawled form, no gas is caught in the groove parts 3 at the time of encapsulation of the sealing resin. The resin 7 flowed in these groove parts 3 is engaged with the groove parts 3 of the supporting part 2 to prevent the groove parts 3 and the supporting part 2 from slipping from each other and a centralization of a shearing stress, which is generated at the time of heat shrinkage, is dispersed. Thereby, the crack of the place of the sealing resin for sealing a semiconductor device and the peeling of the sealing resin from the substrate supporting part are prevented. |
