| 摘要 |
<p>PURPOSE:To obtain a highly reliable semiconductor device wherein exfoliation and crack do not generate between the rear of a stage and resin by providing the rear of a stage with a resin flowing hole having, on the end edge of an aperture, a protruding part toward the inside of the aperture. CONSTITUTION:On the rear of a stage 12 to mount a semiconductor element, a resin flowing hole 18 is provided, which has, on the end-portion of an aperture, a protruding part 30 toward the inside of the aperture. As a result, exfoliation and crack do not generate between the rear of a stage 12 and resin, at the time of resin sealing, even if pressure is applied between both of the two, as the result that the resin flows into the resin flowing hole 18, the protruding part 30 encroaches in the resin, and the water content which has permeated into the resin is evaporated and expanded by dipping during the bath of molten solder and the like. Thereby, a highly reliable semiconductor device can be obtained.</p> |
