| 摘要 |
PURPOSE:To enable the voltage to be measured with high precision without increasing the space of a chip by a method wherein a plurality of voltage measuring sense pads electrically connected to a plurality of bonding pads for signal are arranged in the direction substantially perpendicular to the outer side of a semiconductor integrated circuit chip. CONSTITUTION:Respective voltage circuit measuring pads 4 are electrically connected to bonding pads 2 for signal arranged on edge parts 1a of a semiconductor integrated circuit chip 1 so that, even if the sense pads 4 are supplied with high current in case of a wafer test, the voltage on the bonding pads 2 may be measured through the intermediary of the sense pads 4 and he probes 5 of probe cards. Furthermore, the sense pads 4 opposing to the bonding pads 2 are arranged in the direction perpendicular to the outer side 1b of the semiconductor integrated circuit chip 1 so that the voltage measuring sense pads 4 may be provided restraining the space of the semiconductor integrated circuit chip 1 from increasing. Through these procedures, the voltage can be measured with high precision without increasing the space of the chip 1. |
