| 摘要 |
PURPOSE:To make a mounting area of an IC small by a method wherein an extension part between a wire bonding position of a wiring pattern and a cavity pattern is formed as a pattern whose width is wider than that of the wiring pattern and whose area is large. CONSTITUTION:Regarding a wiring pattern 1 connected to a cavity pattern 2, a part between wire bonding positions 1a', 1b' and the cavity pattern 2 is formed as a pattern 8 whose width is wider than that of the wiring pattern 1 and whose area is large. Alternatively, it is formed as a pattern whose resistance to a flow of an adhesive is large. By this setup, the wire bonding positions 1a', 1b' on the wiring pattern 1 connected to the cavity pattern 2 can be approached to an IC 3; a mounting area of the IC 3 can be made small. |
