发明名称 |
Cooling system for an electronic circuit device |
摘要 |
A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
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申请公布号 |
US4879632(A) |
申请公布日期 |
1989.11.07 |
申请号 |
US19860914942 |
申请日期 |
1986.10.03 |
申请人 |
FUJITSU LIMITED |
发明人 |
YAMAMOTO, HARUHIKO;SUZUKI, MASAHIRO;UDAGAWA, YOSHIAKI;NAKATA, MITSUHIKO;KATSUYAMA, KOJI;ONO, IZUMI;KIKUCHI, SHUNICHI |
分类号 |
G02F1/00;G11B5/64;G11B11/105;H01L23/433;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
G02F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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