发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To attach wires accurately to the specific positions of bonding pads, by forming longitudinal and transverse alignment marks in the vicinity of the bonding pads. CONSTITUTION:Alignment marks 5a and 5b which make it possible to determine biaxial positioning are formed in the vicinity of bonding pads 2a and 3a. Then, one of the alignment marks 5b which is formed in the transverse direction is recognized and using its position as an original point, the other one of the alignment marks 5b which is formed in the transverse direction is confirmed. Further, the alignment marks 5a which are formed in the longitudinal direction are recognized and wires are attached to positions where the longitudinal and transverse directional alignment marks 5a and 5b intersect at right angles. Thus, this device may attach the wires accurately to the determined positions of the bonding pads by using the bonding pads as references.
申请公布号 JPH01276635(A) 申请公布日期 1989.11.07
申请号 JP19880106964 申请日期 1988.04.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJITA KOICHI
分类号 H01L21/60 主分类号 H01L21/60
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