SINTERED ELECTRONIC COMPONENT HAVING THROUGH HOLE AND MANUFACTURE THEREOF,申请号JP19880106661-传众专利搜索

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发明名称	SINTERED ELECTRONIC COMPONENT HAVING THROUGH HOLE AND MANUFACTURE THEREOF
摘要
申请公布号	JPH01276709(A)	申请公布日期	1989.11.07
申请号	JP19880106661	申请日期	1988.04.28
申请人	TAIYO YUDEN CO LTD	发明人	SAKAI TOSHIMITSU;KUROSHIMA HIDEO;KURIHARA SHOICHI
分类号	H01F41/02;H01F17/06	主分类号	H01F41/02
代理机构		代理人
主权项
地址

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