SOLDERING METHOD FOR LEADLESS CHIP CARRIER TYPE IC,申请号JP19880103844-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	SOLDERING METHOD FOR LEADLESS CHIP CARRIER TYPE IC
摘要
申请公布号	JPH01276696(A)	申请公布日期	1989.11.07
申请号	JP19880103844	申请日期	1988.04.28
申请人	OKI ELECTRIC IND CO LTD	发明人	KANAZAWA JUNICHI;SHIGETOMI TATSUO
分类号	H05K3/34	主分类号	H05K3/34
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Preparation of 2-methylpentadiamine

Hydrogenation catalyst useful in the production of alpha-6-deoxytetracyclines

Method of preparing a coarse-pored formed carbon

Silicone-based fabric finishing agent

Derivatives of the uronic acid

Catalyst to eliminate noxious substances contained in the exhaust gases of predominantly alcohol fueled internal combustion engines, a process for its preparation, and uses

Chill roll printing

Curing process for the manufacture of thermoplastic elastomer binders

Nerve connector and method

ANTIMOLD AGENT FOR FOOD

SURFACE ACOUSTIC WAVE OSCILLATOR

PRODUCTION OF ETHYLENE POLYMER COMPOSITION

CONTROL DEVICE FOR VEHICLE AIR CONDITIONER

ACTIVE TYPE SUSPENSION

TWO-WAY PITCH CHANGING DEVICE

CONTROLLER OF VARIABLE CAPACITY MOTOR FOR HYDRAULIC DRIVEN VEHICLE

LINEARLY SLIDING BEARING

CORE-SHELL POLYMER

Calibrating and metering device for a mixture of gases.