| 摘要 |
<p>PURPOSE:To enable a resistor to be provided in the vicinity of a laser diode by providing on a board a separating groove between the laser diode and the resistor. CONSTITUTION:A substrate 2 is welded to a metal stem 1, and a strip wire 4 and a resistor 6 are provided on a heat sink 2. A laser diode 5 is mounted on part of the strip wire 4, and the upper electrode of the diode 5 is connected to the resistor 6 through a lead wire 7. A separating groove 8 is provided in the substrate 2, positioned between the diode 5 and the resistor 6. By providing the groove 8, generated heat on the resistor 6 conducts to the stem 1 to restrict the influence of heat generation of the resistor 6 on the diode 5. Hereby, the resistor 6 can be disposed in the vicinity of the diode 5 to provide a laser diode chip carrier excellent in high frequency characteristics.</p> |
