HIGH DENSITY INTEGRATED CIRCUIT SUPPORTER AND EQUIPMENT FOR SELECTIVE TIN-PLATING OF CONDUCTOR OF THE SUPPORTER

摘要

PURPOSE: To perform OLB(Outer Lead Bonding) operation easily at a minimum cost by providing a conductor to be connected with the terminal of an integrated circuit with a tin plated region. CONSTITUTION: An insulating film 12 has a window 13 for receiving a conductor 14 connectible with the terminal of an integrated circuit 11 in cantilever state. The conductor 14 is provided with a tin plated region 19 on the inside of the window. A tin plating bath comprises a vice 21 for tightening the conductor 14 and tin is introduced through a through hole 22 such that the region 19 of the conductor can be immersed into the tin while feeding a jet gas to the tin plated region 19. According to the arrangement, a compact and uniform tin layer is bonded onto copper and subsequent OLB welding process can be facilitated.