发明名称 Heat insulating structures for low-temperature or cryogenic pipings
摘要 PCT No. PCT/US84/00892 Sec. 371 Date Jan. 22, 1986 Sec. 102(e) Date Jan. 22, 1986 PCT Filed Jun. 7, 1984 PCT Pub. No. WO86/00122 PCT Pub. Date Jan. 3, 1986.A heat insulating structure for low-temperature or cryogenic pipings, comprising at least one heat insulating barrier and at least one moisture barrier which are laid on the outer surface of a piping to be heat-insulated, and at least one sheating layer, wherein said heat insulating barrier comprises an extruded styrenic resin foam and wherein, as expressed in terms of the three-dimensional coordinates X (circumferential direction), Y (thicknesswise direction) and Z (longitudinal direction), said heat insulating barrier has a Y-axial water vapor permeability Py of 1.5 g/m2xhr or less and at least the heat insulating barrier most adjacent to said piping has X-axial and Z-axial elongations at rupture Ex and Ez in the range of 8 to 40 percent.
申请公布号 US4878520(A) 申请公布日期 1989.11.07
申请号 US19860083351 申请日期 1986.01.22
申请人 ASAHI KASEI KOGYO KABUSHIKI KAISHA;THE DOW CHEMICAL COMPANY 发明人 NAKAMURA, MASAO;TONOKAWA, HIROSHI
分类号 F16L59/02;F16L59/14 主分类号 F16L59/02
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