| 摘要 |
PURPOSE:To form a plurality of circuits into a composite circuit by providing a first and a second semiconductor chips with the main surfaces faced opposingly, connecting them through the terminals provided at the main surfaces and then connecting them to external leads through the peripheral terminals of the first semiconductor chip. CONSTITUTION:A semiconductor IC having a function, wirings thereof and terminals 3, 4 are formed on the main surface of a semiconductor chip A, while a semiconductor IC having other function, wirings and terminal 5 are formed on the main surface of a semiconductor chip B. The main surface of chip B faces the main surface of chip A and these are connected between the connecting pads 3, 5 through a solder 6. The pad 4 at the periphery of chip A is connected electrically to external lead 8 through a bonding wire 7. The chips A, B exchange electrical signals through the connecting pads 3, 5, and when a current is applied through external lead 8, these chips operate as a composite circuit. |
