发明名称 |
PB ALLOY SOLDER FOR SEMICONDUCTOR DEVICE |
摘要 |
<p>PCT No. PCT/JP83/00065 Sec. 371 Date Oct. 31, 1983 Sec. 102(e) Date Oct. 31, 1983 PCT Filed Mar. 2, 1983 PCT Pub. No. WO83/03163 PCT Pub. Date Sep. 15, 1983.A soft solder of Pb alloy for semiconductor devices that contains 1 to 65 wt % of Sn or In or both, the balance being Pb and incidental impurities which include less than 50 ppb of radioisotopes and the count of radioactive alpha-particles being not more than 0.5 CPH/cm2. The solder exhibits high adhesive strength and good wettability. The properties of this material may be further improved by addition of 1 to 10 wt % of Ag.</p> |
申请公布号 |
EP0103025(B1) |
申请公布日期 |
1989.11.02 |
申请号 |
EP19830900801 |
申请日期 |
1983.03.02 |
申请人 |
MITSUBISHI KINZOKU KABUSHIKI KAISHA;MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HOSODA, NAOYUKI;UCHIYAMA, NAOKI;KAWANAKA, RYUUSUKE |
分类号 |
C22C11/00;B23K35/26;C22C13/00;C22C28/00;H01L21/52;H01L21/58;H01L23/02;H01L23/10;H01L23/14;H01L23/488 |
主分类号 |
C22C11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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