发明名称 BAUELEMENT IN CHIP-BAUWEISE ZUM BEFESTIGEN AUF EINER SCHALTPLATTE, MIT EINEM ELEKTRISCHEN ODER ELEKTRONISCHEN FUNKTIONSKOERPER
摘要 A chip component incorporating an electrical or electronic function member (2) and having terminal elements (7, 8) is integrated in a pre-fabricated housing (9) of cup shape composed of insulating material, with the function member (2) being held in the housing (9) by supporting elements (12) so as to form at least one air gap (10) that is 1 mm less wide and that separates the function member (2) from the inner housing surfaces (11) on all sides except where the function member (2) is fixed in the housing (9) with small-area supporting elements (12).
申请公布号 DE3813435(A1) 申请公布日期 1989.11.02
申请号 DE19883813435 申请日期 1988.04.21
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 UTNER, FERDINAND, 8400 REGENSBURG, DE
分类号 H01G4/12;H01C1/02;H01C17/00;H01C17/02;H01G2/02;H01G2/06;H01G4/18;H01G4/224;H01G4/252;H01G9/004;H01G9/06;H01G9/08 主分类号 H01G4/12
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