WAVESOLDERING DEVICE AND PROCEDURE

摘要

The description refers to a device and a procedure for the wavesoldering of printed circuits, in particular for the soldering of components suitable for the surface mounting. As claimed in the invention the soldering wave - or a portion of the same - is formed by molten solder flows progressing in an orbital direction. Said flows can progress horizontally (0) with a direction that cyclically moves between 0 and 360 DEG , causing the removing of gas/air bubbles - in case they are trapped near a component (11) - in any position they stagnate. Any soldering failure due to ''dry soldering'' is therefore avoided.