发明名称 PACKAGED PHOTORESIST MATERIAL
摘要 A package for photoresist material, particularly a dry resist, is substantially impermeable to water vapor, thereby preventing humidity-related effects which adversely influence the processability of the photoresist. The package can comprise a film tubing, the ends of which are closed by welding or gluing, into which a photoresist roll is placed. As the material for the film tubing, a composite material can be used which is formed of a polyester film as the support film, to which an aluminum foil is laminated or which is vacuum-metallized with aluminum and a polyethylene film laminated on top. A tinplate container can also be used as a package, the container being closed by soldering after placing the photoresist material inside the container. These packages generally have a permeability to water vapor of less than 0.01 gram of water vapor per square meter per day, at a humidity gradient of 97% and an ambient temperature of 23 DEG C.
申请公布号 AU590293(B2) 申请公布日期 1989.11.02
申请号 AU19860059734 申请日期 1986.07.03
申请人 HOECHST AKTIENGESELLSCHAFT 发明人 HANS WILSKI;HERMANN SCHMIDT
分类号 B65D65/02;B32B15/085;B65D81/26;B65D85/00;(IPC1-7):B65D81/20;B65D85/50;G03C3/00;B65D85/62;B65D85/671;B65D65/40 主分类号 B65D65/02
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