| 摘要 |
PURPOSE:To dissolve the water film adhesion between a worked item and a blade due to the surface tension of coolant and surely unload the worked item by sucking by a method wherein pressure gas is blasted from a pressure gas blasting means between the suction-held worked item and the blade. CONSTITUTION:Pressure gas is blasted through pressure passages 33 from respective blasting nozzles 40 between a blade 10 and a silicon wafer W'. The pressure of said gas is set so as to overcome the wafer film adhesive force between the blade 10 and the silicon wafer W' due to the surface tension of coolant, which is supplied to the blade 10 during slicing so as to prevent the blade 10 from being heated by the frictional heat of a cutting edge 11 at the cutting-off of a silicon ingot W and, as a result, has entered between the blade 10 and the silicon wafer W'. Accordingly, the blade 10 is pushed away so as to part from the silicon wafer W' by the blasting force of the pressure gas, which is blasted from the respective blasting nozzles, resulting in allowing the silicon wafer W' to separate from the blade 10 and to surely unload the silicon wafer W' by suction. |
