| 摘要 |
PURPOSE:To omit a washing treatment using organic solvent by containing nonionic surface active agent in a pressure sensitive adhesive agent layer crosslinkingly treated and making a polished water clean with only washing treatment by water after the separation of a protecting member. CONSTITUTION:A pressure sensitive adhesive agent layer 2 stuck on the formation surface of a circuit pattern of a semiconductor is crosslinkingly treated to form so that pressure sensitive adhesive which is solution in which nonionic interface active agent is prepared and in which crosslinking modacrylic copolymer of number average molecular weight 400,000 or more is made a main constituent is made gel containment of 40% or more. Thereby a polished wafer after a protecting member is separated is made clean with only washing treatment by water without the washing treatment by organic solvent.
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